Process Assistant TEM What you will do You will be a member of our SEM/TEM team, part of imec’s semiconductor technology and systems (STS) unit. This team is responsible for in-line and out-of-line released electron microscopy
Director, 2.5D and 3D Advanced Packaging Technologies What you will do In thisrole, you will drive the development of advanced 2.5D and 3D packaging technologies from early research through platform deployment across imec organization.Acting as the
Alors que les villes deviennent toujours plus complexes, le besoin de mobilité des individus augmente en conséquence. Fluidifier la circulation urbaine nécessite du talent et de lambition. Ensemble, chez KONE, nous créons la nouvelle réalité urbaine.
Process Engineer Dicing What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible.
Information Protection & DLP SolutionArchitect What you will do Are you passionate about protectingvaluable information while enabling innovation? At imec, you will help safeguard some ofthe worlds most advanced semiconductor research, intellectual property andtechnology innovations. Working
Analog IC Designer – SoC for Neurotech At imec, we craft state-of-the-art neurotechnology products that aim to advance neuroscience research. Our systems-on-a-chip require advanced analog circuits for ultra-low-noise amplification, analog-to-digital conversion, power management, among others. Do you
Memory Device Engineer for Bilateral Projects What you will do Novel memory and selector technologies, including resistive memories, chalcogenide-based memories and selector devices, are attracting strong interest for future high-density, energy-efficient memory solutions and hardware platforms
Researcher Advanced Contacts Role Overview One of the central challenges in beyond‑2 nm chip technologies is the scaling of electrical contacts. To address this, imec seeks to strengthen its research by hiring a Thin Film Deposition
Digital Designer — CPU Subsystem (RTL & Verification) (Temporary Assignment) Compute System Architecture (CSA) is imecs center of excellence for hardware-software-technology co-design of future compute systems. We work in close collaboration with imecs expertise centers in
SystemC/TLM-2.0 Modeling Engineer — CPU Subsystem (Temporary Assignment) Compute System Architecture (CSA) is imecs center of excellence for hardware-software-technology co-design of future compute systems. We work in close collaboration with imecs expertise centers in applications, technology,
R&D Lab Assistant What you will do In this hands-on role, you will play a key part in advancing innovative research projects by preparing and analysing samples, conducting laboratory experiments, and operating state-of-the-art characterization equipment. that
Researcher in Novel Materials for Future High-performance Logic What you will do The scaling roadmap of logic technologies continues to evolve, creating opportunities for materials beyond silicon. Among the most promising candidates are two-dimensional semiconductors and
Integration Manager Academic Research What you will do Imec has a long-standing and strategic relationship with specific research groups at Flemish universities. These groups consist of about 850 talented researchers in 13 research groups, working on
Linux & HPC Systems Engineer Are you passionate about Linux, automation, and high-performance computing? Do you enjoy solving complex technical challenges while supporting cutting-edge research? Join imec as a Linux & HPC Systems Engineer and play
Alors que les villes deviennent toujours plus complexes, le besoin de mobilité des individus augmente en conséquence. Fluidifier la circulation urbaine nécessite du talent et de lambition. Ensemble, chez KONE, nous créons la nouvelle réalité urbaine.
Device Modelling R&D Team Leader What you will do With semiconductor device scaling nearing fundamental limitations, innovation increasingly depends on design-technology co-optimization (DTCO) and system-technology co-optimization (STCO). The device modeling team plays a key role in
Etch Expert for Sustainable Technologies Background The manufacturing of integrated circuits (ICs) is one of the most technologically advanced industrial activities in the world, involving hundreds to thousands of tightly controlled process steps and the consumption
Pilot Line Process Engineer – Atomic Layer Deposition What you will do The Pilot Line Engineer is responsible for: Daily follow-up of process & tool qualification, stability, improvements and problem prevention. Troubleshoots issues related to the
Postdoc Researcher Dry Etch for 2D and 1D materials Background Low dimensionality materials, like transition metal dichalcogenides (TMDCs, 2D) or single-walled carbon nanotubes (SWCNTs, 1D) are driving attention in view of their superior transport properties, which
ASIC Solution Architect Imec.IC-link is a complete ASIC(application-specific integrated circuit) solutions provider that can manage thefull product lifecycle– serving start-ups, SMEs and established OEMs as well as universities. Our highly experienced ASIC development team realizes over