R&D Engineer Dry Etch Background As the demand for higher memory density and performance continues to grow, advanced 3D memory technologies such as 3D NAND and emerging 3D DRAM are becoming increasingly important. The fabrication of these
Groupe international d’ingénierie et dexpertise en technologies, fortil repose sur un modèle indépendant et rassemble plus de 2 500 collaborateurs. Avec 30 agences réparties dans 14 pays, fortil cultive la liberté dentreprendre et la libération des
R&D Release Technology Process Engineer What you will do You will develop and optimize wafer release technologies that make advanced heterogeneous integration possible. Heterogeneous integration combines different materials, devices, and technologies into a single system to