R&D Release Technology Process Engineer What you will do You will develop and optimize wafer release technologies that make advanced heterogeneous integration possible. Heterogeneous integration combines different materials, devices, and technologies into a single system to
Process Engineer Die to Wafer bonding What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies
SCD/3D passive Device Characterization Engineer – Advanced Logic & Superconducting Devices What you will do The Compute Device team develops and applies advanced electrical characterization and data-analysis methods to understand device performance, process variability, yield and
Locatie - Geel Find out more about the daily tasks, overall responsibilities, and required experience for this opportunity by scrolling down now. Versterk het Manufacturing Science, Analytical & Technology (MSAT) team als wetenschappelijke spil tussen ontwikkeling