Process Engineer – Thin film and wafer metrology What you will do Manage and optimize thin-film and wafer metrology tools, developing automated measurement recipes and ensuring equipment stability, quality, throughput, and safety. You will be a member of the
Process Engineer Thin Film Deposition: Dielectrics Background Advances in AI are driving a huge demand for semiconductor technologies to deliver high computational power and energy efficiency. The complexity in the fabrication flow have lead to needs for new
R&D Thin Films Engineer Background Advances in AI and semiconductor technologies are increasingly intertwined, with AI driving new demands for faster, more efficient chips, while cutting‑edge semiconductor innovations enable the next generation of AI workloads. This needs continuous
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
Team Leader for Calibration Products Engineering About the Role IMECs unique position, infrastructure and R&D capabilities enable it to produce calibration wafer products for advanced semiconductor process and tool calibration. Customers use these wafers to maintain
LAB Hardware Engineer - Process Tools Imec is the world-leading research and innovation hub in nanoelectronics and digital technologies. The combination of our widely acclaimed leadership in microchip technology and profound software and ICT expertise is
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
Post-doctoral Researcher Topological Semimetals for Advanced Interconnects The successful candidate will explore the fundamental properties and integration potential of these emerging materials and assess their suitability for advanced interconnect applications. Responsibilities include the deposition, optimization, and
R&D Engineer - Deposited Resists Background Continued device scaling and the introduction of increasingly complex three-dimensional architectures place demanding requirements on lithographic materials. Conventional spin-coated resists face challenges related to film thickness control, conformality, patterning performance, and
Lead Process Integration Engineer for Specialized Products Engineering Turn first-of-a-kind technologies into advanced products Some of our advanced products are built on top of standard CMOS substrates, including ultra-high-density DNA sequencers, advanced biosensors and other heterogeneously
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more