Program Coordination Officer Flanders AI Research Program (Temporary assignment) What you will do As Research ProgramCoordination Officer in theFlanders AI Research Program, you support the successful execution of theprogram. This is a fixed-term employment contract until June 2027 with
R&D Release Technology Process Engineer What you will do You will develop and optimize wafer release technologies that make advanced heterogeneous integration possible. Heterogeneous integration combines different materials, devices, and technologies into a single system to
Principal Performance Architect What you will do You will architect software-hardware codesign innovations for next-gen artificial intelligence high-performance computing systems. The Compute System Architecture Unit (CSA) at imec is researching next-generation large-scale heterogeneous computer architectures. The
Process Engineer Die to Wafer bonding What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies
Funded Manager - Connectivity What you will do Imecs R&D programs are supported by funded projects with industrial players and research centers. The “Regional Innovation and Collaboration Hub” group is responsible for coordinating all funding activities at
R&D Engineer Dry Etch Background As the demand for higher memory density and performance continues to grow, advanced 3D memory technologies such as 3D NAND and emerging 3D DRAM are becoming increasingly important. The fabrication of
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more