Process Integration Engineer PWD The Product and Wafer delivery group (PWD) is looking for a process integration engineer to help build and deliver a growing volume of high value niche products for some of IMEC’s strategic partners. Having
Postdoctoral Researcher in In-Operando Photoemission for Semiconductor Technologies What you will do As device dimensions continue to shrink, surfaces and buried interfaces increasingly define performance, reliability and long-term stability. This postdoctoral position offers the opportunity to turn
R&D Release Technology Process Engineer What you will do You will develop and optimize wafer release technologies that make advanced heterogeneous integration possible. Heterogeneous integration combines different materials, devices, and technologies into a single system to achieve
Join VeroTech as a Lithography Process Development Assistant and become part of our community where innovation and people come first. You’ll take on exciting technical challenges and develop your expertise while creating solutions that drive progress across
Process Engineer Die to Wafer bonding What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make
Litho Process Engineer What you will do As Litho Process Engineer you will be a member of the Advanced Litho Process group which is part of the Angstrom Patterning Department. As Litho Process Engineer you are responsible for: Analysing and
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
Postdoctoral Researcher: Biologically Inspired Motion Systems for Robotics Current actuator technologies facesignificant limitations in applications where compactness, softness, silentoperation, and biological compatibility are essential. Conventionalelectromagnetic motors are often bulky, rigid, noisy, difficult to miniaturizeand require power
Join one of the largest industrial security teams and build technology that protects real devices, worldwide. At NXP’s Competence Center Crypto & Security, we design, build, and deliver end-to-end security — from innovation to architecture to
Build the AI capability that lets a fast-moving deep-tech company punch above its size — and protect the IP that makes it hard to copy. Why this role matters At Swave Photonics we are pioneering holographic
Principal Performance Architect What you will do You will architect software-hardware codesign innovations for next-gen artificial intelligence high-performance computing systems. The Compute System Architecture Unit (CSA) at imec is researching next-generation large-scale heterogeneous computer architectures. The
Join one of the world’s largest industrial security teams — and build technology that protects real devices worldwide. At NXP’s Competence Center Crypto & Security, we design, build, and deliver end-to-end security — from early innovation
Litho R&D Engineer What you will do As Litho R&D Engineer you will be a member of the Advanced Litho Process group which is part of the Angstrom Patterning Department. As Litho R&D Engineer you are responsible
Thermal Mechanical R&D Engineer for Advanced Cooling Solutions What you will do The Thermal Management and Cooling Solutions team investigates the thermal behavior and cooling requirements of future electronic systems, ranging from transistors and devices to
Principal Member of Technical Staff – IC Test Architecture & Silicon Validation We are looking for a Principal Member of Technical Staff – IC Test Architecture & Silicon Validation to lead the testing and validation of
R&D Engineer Dry Etch Background As the demand for higher memory density and performance continues to grow, advanced 3D memory technologies such as 3D NAND and emerging 3D DRAM are becoming increasingly important. The fabrication of