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Process Engineer Dicing What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible.
R&D Engineer Electroplating Supporting R&D activities for imec’s advanced technology programs Electroplating has been the technology of choice in forming metal interconnects in integrated circuits. Key requirements for future interconnect technology, quantum computing applications and 3D processing are
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