Process Engineer Die to Wafer bonding What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies
Thermal Mechanical R&D Engineer for Advanced Cooling Solutions What you will do The Thermal Management and Cooling Solutions team investigates the thermal behavior and cooling requirements of future electronic systems, ranging from transistors and devices to
Principal Member of Technical Staff – IC Test Architecture & Silicon Validation We are looking for a Principal Member of Technical Staff – IC Test Architecture & Silicon Validation to lead the testing and validation of