Memory Device Engineer for Bilateral Projects What you will do Novel memory and selector technologies, including resistive memories, chalcogenide-based memories and selector devices, are attracting strong interest for future high-density, energy-efficient memory solutions and hardware platforms for data-intensive
Device Modelling R&D Team Leader What you will do With semiconductor device scaling nearing fundamental limitations, innovation increasingly depends on design-technology co-optimization (DTCO) and system-technology co-optimization (STCO). The device modeling team plays a key role in this xTCO research, enabling
Process Engineer Dicing What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible.
Researcher in Novel Materials for Future High-performance Logic What you will do The scaling roadmap of logic technologies continues to evolve, creating opportunities for materials beyond silicon. Among the most promising candidates are two-dimensional semiconductors and related
Postdoc Researcher Dry Etch for 2D and 1D materials Background Low dimensionality materials, like transition metal dichalcogenides (TMDCs, 2D) or single-walled carbon nanotubes (SWCNTs, 1D) are driving attention in view of their superior transport properties, which
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
R&D Process Integration Engineer (Pathfinding Integration) What you will do You will be working in the pathfinding integration department, contributing and supervising projects to either the R&D programs or to bilateral (Research on Demand) projects. You
R&D Engineer for bevel management What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make