Process Engineer Dicing What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible.
Memory Device Engineer for Bilateral Projects What you will do Novel memory and selector technologies, including resistive memories, chalcogenide-based memories and selector devices, are attracting strong interest for future high-density, energy-efficient memory solutions and hardware platforms
SystemC/TLM-2.0 Modeling Engineer — CPU Subsystem (Temporary Assignment) Compute System Architecture (CSA) is imecs center of excellence for hardware-software-technology co-design of future compute systems. We work in close collaboration with imecs expertise centers in applications, technology,
R&D Lab Assistant What you will do In this hands-on role, you will play a key part in advancing innovative research projects by preparing and analysing samples, conducting laboratory experiments, and operating state-of-the-art characterization equipment. that drives
Etch Expert for Sustainable Technologies Background The manufacturing of integrated circuits (ICs) is one of the most technologically advanced industrial activities in the world, involving hundreds to thousands of tightly controlled process steps and the consumption
Postdoc Researcher Dry Etch for 2D and 1D materials Background Low dimensionality materials, like transition metal dichalcogenides (TMDCs, 2D) or single-walled carbon nanotubes (SWCNTs, 1D) are driving attention in view of their superior transport properties, which
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
R&D Engineer Electroplating Supporting R&D activities for imec’s advanced technology programs Electroplating has been the technology of choice in forming metal interconnects in integrated circuits. Key requirements for future interconnect technology, quantum computing applications and 3D
R&D Engineer for bevel management What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make