Postdoctoral Researcher in In-Operando Photoemission for Semiconductor Technologies What you will do As device dimensions continue to shrink, surfaces and buried interfaces increasingly define performance, reliability and long-term stability. This postdoctoral position offers the opportunity to turn advanced
At Capgemini Engineering, the world leader in engineering services, we bring together a global team of engineers, scientists, and architects to help the world’s mostinnovative companies unleash their potential. From autonomous cars to life-saving robots, our
SCD/3D passive Device Characterization Engineer – Advanced Logic & Superconducting Devices What you will do The Compute Device team develops and applies advanced electrical characterization and data-analysis methods to understand device performance, process variability, yield and reliability. We are looking
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
Overview Bruker is enabling scientists and engineers to make breakthrough post-genomic discoveries and develop new applications that improve the quality of human life. Bruker’s high performance scientific instruments and high value analytical and diagnostic solutions enable
Postdoctoral Researcher: Biologically Inspired Motion Systems for Robotics Current actuator technologies facesignificant limitations in applications where compactness, softness, silentoperation, and biological compatibility are essential. Conventionalelectromagnetic motors are often bulky, rigid, noisy, difficult to miniaturizeand require power
Join one of the largest industrial security teams and build technology that protects real devices, worldwide. At NXP’s Competence Center Crypto & Security, we design, build, and deliver end-to-end security — from innovation to architecture to products
R&D Release Technology Process Engineer What you will do You will develop and optimize wafer release technologies that make advanced heterogeneous integration possible. Heterogeneous integration combines different materials, devices, and technologies into a single system to achieve
Principal Performance Architect What you will do You will architect software-hardware codesign innovations for next-gen artificial intelligence high-performance computing systems. The Compute System Architecture Unit (CSA) at imec is researching next-generation large-scale heterogeneous computer architectures. The
Process Engineer Die to Wafer bonding What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies
Join one of the world’s largest industrial security teams — and build technology that protects real devices worldwide. At NXP’s Competence Center Crypto & Security, we design, build, and deliver end-to-end security — from early innovation to
Thermal Mechanical R&D Engineer for Advanced Cooling Solutions What you will do The Thermal Management and Cooling Solutions team investigates the thermal behavior and cooling requirements of future electronic systems, ranging from transistors and devices to complete
Principal Member of Technical Staff – IC Test Architecture & Silicon Validation We are looking for a Principal Member of Technical Staff – IC Test Architecture & Silicon Validation to lead the testing and validation of
R&D Engineer Dry Etch Background As the demand for higher memory density and performance continues to grow, advanced 3D memory technologies such as 3D NAND and emerging 3D DRAM are becoming increasingly important. The fabrication of