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Postdoc Researcher Dry Etch for 2D and 1D materials Background Low dimensionality materials, like transition metal dichalcogenides (TMDCs, 2D) or single-walled carbon nanotubes (SWCNTs, 1D) are driving attention in view of their superior transport properties, which can
R&D Engineer Electroplating Supporting R&D activities for imec’s advanced technology programs Electroplating has been the technology of choice in forming metal interconnects in integrated circuits. Key requirements for future interconnect technology, quantum computing applications and 3D processing are