Researcher in Novel Materials for Future High-performance Logic What you will do The scaling roadmap of logic technologies continues to evolve, creating opportunities for materials beyond silicon. Among the most promising candidates are two-dimensional semiconductors and related low-dimensional
Postdoc Researcher Dry Etch for 2D and 1D materials Background Low dimensionality materials, like transition metal dichalcogenides (TMDCs, 2D) or single-walled carbon nanotubes (SWCNTs, 1D) are driving attention in view of their superior transport properties, which can find
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
R&D Team Leader Compute Integration What you will do You will be leading one of the Compute Process Integration teams, in the Pathfinding Integration Department. The team is responsible for setting up and maintaining integration flow
Process Engineer Dicing What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible.
Memory Device Engineer for Bilateral Projects What you will do Novel memory and selector technologies, including resistive memories, chalcogenide-based memories and selector devices, are attracting strong interest for future high-density, energy-efficient memory solutions and hardware platforms
Researcher Advanced Contacts Role Overview One of the central challenges in beyond‑2 nm chip technologies is the scaling of electrical contacts. To address this, imec seeks to strengthen its research by hiring a Thin Film Deposition
Location: Leuven,Vlaanderen,België For our office in Leuven, we are looking for highly qualified and motivated professionals like you. If you think you have what it takes to keep Septentrio firmly in Pole Position, get in touch.
Job location: London (UK), Leuven & Ostend (Belgium) Join us as we work to unlock the value of offshore wind! JERA Nex bp is a new joint venture between JERA, Japan’s largest power generation company, and
Device Modelling R&D Team Leader What you will do With semiconductor device scaling nearing fundamental limitations, innovation increasingly depends on design-technology co-optimization (DTCO) and system-technology co-optimization (STCO). The device modeling team plays a key role in
Etch Expert for Sustainable Technologies Background The manufacturing of integrated circuits (ICs) is one of the most technologically advanced industrial activities in the world, involving hundreds to thousands of tightly controlled process steps and the consumption
R&D Engineer Electroplating Supporting R&D activities for imec’s advanced technology programs Electroplating has been the technology of choice in forming metal interconnects in integrated circuits. Key requirements for future interconnect technology, quantum computing applications and 3D
R&D Process Integration Engineer (Pathfinding Integration) What you will do You will be working in the pathfinding integration department, contributing and supervising projects to either the R&D programs or to bilateral (Research on Demand) projects. You
R&D Engineer Lithography Tracks What you will do You will be a member of the Litho Track & process team, part of the Advanced Patterning department, responsible for research and development in the lithography domain. You
R&D Inspection Engineer What you will do You will be part of the Metrology and Inspection (M&I) group within the Ångstrom Patterning department. As R&D Inspection Engineer, you will: Work in close collaboration with a major
R&D Engineer for bevel management What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make