Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
Project Architect Backend What you will do IC-Link by Imec project architect team is looking for a technical customer engagement expert to support business development activities. In this role, you will oversee multiple customer ASIC/SoC projects
Company Description TOMRA Food is a multinational organization and a leading provider of sensor-based sorting, peeling and integrated post-harvest solution for the food industries. Transforming global food production to maximize food safety and minimize food loss
Memory Device Engineer for Bilateral Projects What you will do Novel memory and selector technologies, including resistive memories, chalcogenide-based memories and selector devices, are attracting strong interest for future high-density, energy-efficient memory solutions and hardware platforms
Researcher Advanced Contacts Role Overview One of the central challenges in beyond‑2 nm chip technologies is the scaling of electrical contacts. To address this, imec seeks to strengthen its research by hiring a Thin Film Deposition Expert
Researcher in Novel Materials for Future High-performance Logic What you will do The scaling roadmap of logic technologies continues to evolve, creating opportunities for materials beyond silicon. Among the most promising candidates are two-dimensional semiconductors and
Device Modelling R&D Team Leader What you will do With semiconductor device scaling nearing fundamental limitations, innovation increasingly depends on design-technology co-optimization (DTCO) and system-technology co-optimization (STCO). The device modeling team plays a key role in
Camco Technologies is the leading technology company in innovative terminal automation solutions and services. Since 1999, our systems empower marine and railway terminal operators to increase their performance and safety while reducing operating costs. Already 200+
Postdoc Researcher Dry Etch for 2D and 1D materials Background Low dimensionality materials, like transition metal dichalcogenides (TMDCs, 2D) or single-walled carbon nanotubes (SWCNTs, 1D) are driving attention in view of their superior transport properties, which
R&D Engineer Electroplating Supporting R&D activities for imec’s advanced technology programs Electroplating has been the technology of choice in forming metal interconnects in integrated circuits. Key requirements for future interconnect technology, quantum computing applications and 3D
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