Process Engineer Dicing What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within
SystemC/TLM-2.0 Modeling Engineer — CPU Subsystem (Temporary Assignment) Compute System Architecture (CSA) is imecs center of excellence for hardware-software-technology co-design of future compute systems. We work in close collaboration with imecs expertise centers in applications, technology, circuits,
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
R&D Engineer Electroplating Supporting R&D activities for imec’s advanced technology programs Electroplating has been the technology of choice in forming metal interconnects in integrated circuits. Key requirements for future interconnect technology, quantum computing applications and 3D processing
R&D Engineer for bevel management What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this
Postdoc Researcher Dry Etch for 2D and 1D materials Background Low dimensionality materials, like transition metal dichalcogenides (TMDCs, 2D) or single-walled carbon nanotubes (SWCNTs, 1D) are driving attention in view of their superior transport properties, which
Researcher- cryogenic quantum links What you will do Imec’s Exploratory devices and new materials unit is expanding the R&D activity of quantum technology. For this, we are looking for a researcher to strengthen our quantum interconnect