Process Engineer Die to Wafer bonding What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this
R&D Release Technology Process Engineer What you will do You will develop and optimize wafer release technologies that make advanced heterogeneous integration possible. Heterogeneous integration combines different materials, devices, and technologies into a single system to achieve
Process Engineer Dicing What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible.