Job Description What we offer 35 400 to 50 000 gross per year, including holiday allowance and the 13th monthly payment. This role might also be eligible for a sales-based incentive or performance-based bonus. Placement within
Senior Hardware Engineer & Hardware Technician Opportunities The team The LABHW team is part of imec’s Lab Operations & Coordination Department and plays a key role in maintaining and supporting the hardware infrastructure used in our
Job Description At NIQ, we set the standard for being the most trusted data partner in the Tech & Durables (T&D) industry. We did it 100 years ago when we invented the market research industry, and
Job Description At NIQ, we set the standard for being the most trusted data partner in the Tech & Durables (T&D) industry. We did it 100 years ago when we invented the market research industry, and
Job Description NEW BUSINESS DEVELOPER Leauven office - Tech & Durables department About this job At NIQ, we set the standard for being the most trusted data partner in the Tech & Durables (T&D) industry. We
Job Description NEW BUSINESS DEVELOPER LEAD Leuven office - Tech & Durables department What we offer 35 400 to 50 000 gross per year, including holiday allowance and the 13th monthly payment. This role might also
Job Description NEW BUSINESS DEVELOPER Leauven office - Tech & Durables department About this job At NIQ, we set the standard for being the most trusted data partner in the Tech & Durables (T&D) industry. We
Job Description NEW BUSINESS DEVELOPER LEAD Leuven office - Tech & Durables department What we offer 35 400 to 50 000 gross per year, including holiday allowance and the 13th monthly payment. This role might also
Job Description NEW BUSINESS DEVELOPER LEAD Leuven office - Tech & Durables department What we offer 35 400 to 50 000 gross per year, including holiday allowance and the 13th monthly payment. bonus. Placement within the
R&D Release Technology Process Engineer What you will do You will develop and optimize wafer release technologies that make advanced heterogeneous integration possible. Heterogeneous integration combines different materials, devices, and technologies into a single system to achieve
Process Engineer Die to Wafer bonding What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies