R&D Release Technology Process Engineer What you will do You will develop and optimize wafer release technologies that make advanced heterogeneous integration possible. Heterogeneous integration combines different materials, devices, and technologies into a single system to achieve
R&D Engineer Dry Etch Background As the demand for higher memory density and performance continues to grow, advanced 3D memory technologies such as 3D NAND and emerging 3D DRAM are becoming increasingly important. The fabrication of
SCD/3D passive Device Characterization Engineer – Advanced Logic & Superconducting Devices What you will do The Compute Device team develops and applies advanced electrical characterization and data-analysis methods to understand device performance, process variability, yield and
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
Development Engineer (Pathfinding Integration) What you will do You will be working in the pathfinding Integration department, contributing to either the R&D programs or to bilateral (Research on Demand) projects. You will be responsible for coordination
Development Engineer- Platform Team What you will do Platform database management: Set up, maintain, and continuously improve structured databases for platformized process flows, modules, baselines, and inline Statistical Process Control (SPC), ensuring traceability, clarity, consistency, and
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
Process Assistant TEM What you will do You will be a member of our SEM/TEM team, part of imec’s semiconductor technology and systems (STS) unit. This team is responsible for in-line and out-of-line released electron microscopy