Process Engineer Die to Wafer bonding What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies
Position Summary: Zoetis is seeking an agile, hands‑on HR leader to shape the people agenda at our Louvain‑la‑Neuve site (550+ colleagues across manufacturing, R&D, and support functions). LLN produces a range of pharmaceutical and biologic products
Director, 2.5D and 3D Advanced Packaging Technologies What you will do In thisrole, you will drive the development of advanced 2.5D and 3D packaging technologies from early research through platform deployment across imec organization.Acting as the
Process Engineer Dicing What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible.
R&D Engineer in sustainable semiconductors & imec.netzero deployment What you will do Imec develops methodologies, datasets and assessment frameworks that help the semiconductor ecosystem understand and reduce its environmental footprint. In this role, you will contribute
For our office in Leuven, we are looking for highly qualified and motivated professionals like you. If you think you have what it takes to keep Septentrio firmly in Pole Position, get in touch. We need
