Integration Manager Academic Research What you will do Imec has a long-standing and strategic relationship with specific research groups at Flemish universities. These groups consist of about 850 talented researchers in 13 research groups, working on technology
R&D Process Integration Engineer (Pathfinding Integration) What you will do You will be working in the pathfinding integration department, contributing and supervising projects to either the R&D programs or to bilateral (Research on Demand) projects. You will be responsible
R&D Project Leader – Advanced Cooling Integration for High-Performance Computing What you will do As an R&D Project Leader, you will drive the development of next-generation cooling solutions for high-performance computing applications. You will take ownership of
Digital Designer — CPU Subsystem (RTL & Verification) (Temporary Assignment) Compute System Architecture (CSA) is imecs center of excellence for hardware-software-technology co-design of future compute systems. We work in close collaboration with imecs expertise centers in
Researcher in Novel Materials for Future High-performance Logic What you will do The scaling roadmap of logic technologies continues to evolve, creating opportunities for materials beyond silicon. Among the most promising candidates are two-dimensional semiconductors and
Postdoc Researcher Dry Etch for 2D and 1D materials Background Low dimensionality materials, like transition metal dichalcogenides (TMDCs, 2D) or single-walled carbon nanotubes (SWCNTs, 1D) are driving attention in view of their superior transport properties, which
Lithography Process Development Assistant What you will do As a Lithography Process Development Assistant, you will be a member of the Process Efficiency Team, part of the Advanced Patterning Department. This department is responsible for material
R&D Engineer Electroplating Supporting R&D activities for imec’s advanced technology programs Electroplating has been the technology of choice in forming metal interconnects in integrated circuits. Key requirements for future interconnect technology, quantum computing applications and 3D
R&D Engineer for bevel management What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this
Researcher- cryogenic quantum links What you will do Imec’s Exploratory devices and new materials unit is expanding the R&D activity of quantum technology. For this, we are looking for a researcher to strengthen our quantum interconnect