Process Engineer Die to Wafer bonding What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies
SCD/3D passive Device Characterization Engineer – Advanced Logic & Superconducting Devices What you will do The Compute Device team develops and applies advanced electrical characterization and data-analysis methods to understand device performance, process variability, yield and
Process Engineer Dicing What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible.